Sumber Utama
Main menu
- Home
- About Us
-
Products
-
THERMOLAB
-
SUPER FLOWER
-
SHARKOON
-
ORICO
-
COUGAR
-
GEIL
-
CLICKER
-
- Where To Buy
- Info
- Review
- Shop
Tl5 3.5g
Ratio of Thermal transfer material and thermal conductivity are increased by mixing various sizes and particles.
Electric conductivity is removed and thermal conductivity is remarkably increased by mixing metal and ceramic particles in the optimum ratio.
Applicable for :
CPU
GPU
Chipset Memory
Power Module
Other semiconductor components,
High Heat Flux
With Full Package / Loose Pack
Conductivity : 8W/mK
Viscosity : 190 Pa · s
Weight : 2.6
Capacity : 3.7g ± 0.2
Color : Gray
Components :
Thermal Grease: 3.7g ± 0.2 (syringe-
Rubber Bone: 5
User's Guide: Part 1
Heater and heat sink and wipe the surfaces clean.
This product is at the center of the heating elements from 1 to 1.5 degree grid, put the amount of salty.
Enclosed is wearing a thimble will unfold from the center outwards properly.
Paste will spread evenly. (No heating element at the heart of a good idea to spread large quantities remain.)
Replace the heatsink.
After using it after you close the cap on the remaining products and stored at room temperature.
Manual Instruction Guide
